View STW8Q2PAE0E5_9007512.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

z-power led x10490 z-power led x10490 technical data sheet document no. : ssc- qp- 7- 07- 24 rev. 09 rev. 09 september 2011 september 2011 www.seoulsemicon.com www.seoulsemicon.com specification [stw8q2pa] customer approved by checked by supplier approved by drawn by
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc- qp- 7- 07- 24 rev. 09 rev. 09 september 2011 september 2011 www.seoulsemicon.com www.seoulsemicon.com 1. description 2. absolute maximum ratings 3. electro-optical characteristics 4. optical characteristics 5. reliability test 6. color & binning 7. bin code description 8. outline dimension 9. material structure 10. reel structure 11. packing 12. soldering 13. precaution for use 14. handling of silicone resin leds contents
z-power led x10490 technical data sheet document no. : ssc- qp- 7- 07- 24 rev. 09 rev. 09 september 2011 september 2011 www.seoulsemicon.com www.seoulsemicon.com stw8q2pa ? electric signs and signals ? office automation, electrical appliances, industrial equipment features applications 1. description this surface-mount led comes in standard package dimension. it has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. the die is attached within the reflector cavity and the cavity is encapsulated by silicone. the package design coupled with careful selection of component materials allow these products to perform with high reliability. white colored smt package. ? pb-free reflow soldering application ? suitable for all smt assembly methods ; suitable for all soldering methods ? rohs compliant
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc- qp- 7- 07- 24 rev. 09 rev. 09 september 2011 september 2011 www.seoulsemicon.com www.seoulsemicon.com 125 t j junction temperature -40~+100 t stg storage temperature -40~+85 t opr operating temperature ma 300 i fm [2] peak forward current ma 160 i f forward current mw 592 p d power dissipation unit value symbol parameter 2. absolute maximum ratings [1] [1] care is to be taken that power dissipation does not exceed the absolute maximum rating of the prod uct. [2] ifm was measured at tw 1 msec of pulse width and d 1/10 of duty ratio. [3] leds properties might be different from sugges ted values like above and below tables if operation condition will be exceeded our parameter range. - 90 - 80 - 9.0 29 - i f =100ma i v luminous intensity* [2] (3700~7000k) deg. - 120 - i f =100ma 2 1/2 viewing angle [3] oc/w - 15 - i f =100ma r th js thermal resistance [4] kv - - 5 1.5k ? ;100pf esd (hbm) - - 80 75 i f =100ma ra color rendering index* k 7,000 - 2,600 i f =100ma cct color correlated temperature cd lm - 8.5 27.9 - i f =100ma i v luminous intensity* [2] (2600~3700k) v 1.2 0.9 - i r =5ma v r reverse voltage v 3.4 3.2 2.9 i f =100ma v f forward voltage * [1] unit max. typ. min. condition symbol parameter [1] forward current is 50ma per die for parallel in ner circuit. package total forward current is 100ma [2] the luminous intensity iv was measured at the p eak of the spatial pattern which may not be aligne d with the mechanical axis of the led package. [3] 2 1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity. [4] thermal resistance: rthjs (junction / solder), metal pcb 25*25mm 1.6t * tolerance : v f : 0.1v, i v : 10%, ra : 3, x,y : 0.01 [note] all measurements were made under the standar dized environment of ssc. 3. electro-optical characteristics
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc- qp- 7- 07- 24 rev. 09 rev. 09 september 2011 september 2011 www.seoulsemicon.com www.seoulsemicon.com 4. optical characteristics -90 -60 -30 90 60 30 0 directivity ta=25 forward voltage vs. forward current ta=25 0 20 40 60 80 100 120 140 160 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 relative luminous intensity forward current i f [ma] forward current vs. relative luminous intensity ta=25 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 1 10 100 forward current i f [ma] forward voltage v f [v] forward current vs. chromaticity coordinate ta=25 0.336 0.337 0.338 0.339 0.340 0.341 0.360 0.362 0.364 0.366 0.368 20ma 60ma 100ma 150ma 200ma y x
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc- qp- 7- 07- 24 rev. 09 rev. 09 september 2011 september 2011 www.seoulsemicon.com www.seoulsemicon.com relative light output vs. junction temperature i f =100ma 25 50 75 100 125 0.0 0.2 0.4 0.6 0.8 1.0 relative forward voltage ju n ctio n te m p e ra tu re tj( o c ) forward voltage shift vs. junction temperature i f =100ma junction temperature ( ) vs. chromaticity coordinate if=100ma 0.315 0.320 0.325 0.330 0.310 0.315 0.320 0.325 0.330 0.335 25 45 65 85 105 y x 25 50 75 100 125 0.0 0.2 0.4 0.6 0.8 1.0 relative light output ju nctio n tem p erature tj( o c )
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc- qp- 7- 07- 24 rev. 09 rev. 09 september 2011 september 2011 www.seoulsemicon.com www.seoulsemicon.com spectrum ta=25 , i f =100ma 300 400 500 600 700 800 0.0 0.5 1.0 2600~3700k 3700~4700k 4700~7000k relative emission intensity wavelength [nm] ambient temperature vs. maximum forward current -4 0 -2 0 0 2 0 4 0 6 0 8 0 1 0 0 0 2 0 4 0 6 0 8 0 1 0 0 1 2 0 1 4 0 1 6 0 1 8 0 2 0 0 forward current i f [ma] a m b ie n t te m p e ra tu re t a ( o c ) r th j-a = 1 0 0 o c /w
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc- qp- 7- 07- 24 rev. 09 rev. 09 september 2011 september 2011 www.seoulsemicon.com www.seoulsemicon.com 5. reliability test 0/22 3 time 260 < 10sec. reflow soldering t sol reflow 0/22 3 time 5kv at 1.5k ? ; 100pf mil-std- 883d esd(hbm) 0/22 1000 hours t a =-40 o c, i f =100ma internal reference low temperature life test 0/22 500 hours t a =85 o c, i f =100ma internal reference high temperature life test 0/22 500 hours t a =60 o c, rh=90%, i f =100ma internal reference high temperature high humidity life test 0/22 1000 hours t a =25 o c, i f =100ma internal reference operating endurance test 0/22 1000 hours t a =-40 o c eiaj ed-4701 low temperature storage 0/22 1000 hours t a =60 o c, rh=90% eiaj ed-4701 high temp. high humidity storage 0/22 1000 hours t a =100 o c eiaj ed-4701 high temperature storage 0/22 100 cycle t a =-40 o c(30min) ~ 100 o c(30min) eiaj ed-4701 thermal shock number of damaged duration / cycle test conditions reference item - lsl [2] 0.7 i f =100ma i v luminous intensity usl [1] 1.2 - i f =100ma v f forward voltage max min criteria for judgment condition symbol item note : [1] usl : upper standard level [2] lsl : lower standard level criteria for judging the damage
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc- qp- 7- 07- 24 rev. 09 rev. 09 september 2011 september 2011 www.seoulsemicon.com www.seoulsemicon.com 6. color & binning 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 7000k 2600k 2700k 2900k 3000k 3200k 3500k 3700k 4000k 4200k 4500k 4700k 5000k 5300k 5600k 6000k 6500k cie x cie y a5 a3 a1 a9 a6 a4 a2 a0 a8 a7 c8 c9 c0 c1 c2 c3 c4 c5 c6 c7 b8 b9 b0 b1 b2 b3 b4 b5 b6 b7 d8 d9 d0 d1 d2 d3 d4 d5 d6 d7 f8 f9 f0 f1 f2 f3 f4 f5 f6 f7 g8 g9 g0 g1 g2 g3 g4 g5 g6 g7 h8 h9 h0 h1 h2 h3 h4 h5 h6 h7 e8 e9 e0 e1 e2 e3 e4 e5 e6 e7 energy star rank energy star rank
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc- qp- 7- 07- 24 rev. 09 rev. 09 september 2011 september 2011 www.seoulsemicon.com www.seoulsemicon.com 6. color & binning color rank * measurement uncertainty of the color coordinates : 0.01 0.374 0.3381 0.3369 0.3366 0.3451 0.3369 0.3534 0.3373 0.3616 0.3376 0.3616 0.3376 0.3288 0.3364 0.3369 0.3366 0.3451 0.3369 0.3534 0.3373 0.3539 0.3292 0.3234 0.3295 0.3306 0.3294 0.3384 0.3293 0.3461 0.3293 0.3656 0.329 0.3306 0.3294 0.3384 0.3293 0.3461 0.3293 0.3539 0.3292 cie y cie x cie y cie x cie y cie x cie y cie x cie y cie x b9 b7 b5 b3 b1 5300~5600k 0.3656 0.329 0.3306 0.3294 0.3384 0.3293 0.3461 0.3293 0.3539 0.3292 0.3539 0.3292 0.3234 0.3295 0.3306 0.3294 0.3384 0.3293 0.3461 0.3293 0.3462 0.3207 0.3178 0.3226 0.3243 0.3222 0.3316 0.3217 0.3389 0.3212 0.3572 0.32 0.3243 0.3222 0.3316 0.3217 0.3389 0.3212 0.3462 0.3207 cie y cie x cie y cie x cie y cie x cie y cie x cie y cie x b8 b6 b4 b2 b0 5600~6000k 0.319 0.3225 0.3261 0.3221 0.3334 0.3216 0.3408 0.321 0.3481 0.3205 0.311 0.323 0.319 0.3225 0.3261 0.3221 0.3334 0.3216 0.3408 0.321 0.3046 0.3164 0.312 0.3155 0.3187 0.3146 0.3256 0.3136 0.3324 0.3126 0.312 0.3155 0.3187 0.3146 0.3256 0.3136 0.3324 0.3126 0.3393 0.3115 cie y cie x cie y cie x cie y cie x cie y cie x cie y cie x a9 a7 a5 a3 a1 6000~6500k 0.312 0.3155 0.3187 0.3146 0.3256 0.3136 0.3324 0.3126 0.3393 0.3115 0.3046 0.3164 0.312 0.3155 0.3187 0.3146 0.3256 0.3136 0.3324 0.3126 0.298 0.3096 0.3046 0.3082 0.3113 0.3068 0.3177 0.3055 0.324 0.3041 0.3046 0.3082 0.3113 0.3068 0.3177 0.3055 0.324 0.3041 0.3304 0.3028 cie y cie x cie y cie x cie y cie x cie y cie x cie y cie x a8 a6 a4 a2 a0 6500~7000k
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc- qp- 7- 07- 24 rev. 09 rev. 09 september 2011 september 2011 www.seoulsemicon.com www.seoulsemicon.com 6. color & binning color rank * measurement uncertainty of the color coordinates : 0.01 0.3974 0.376 0.3578 0.367 0.3677 0.3692 0.3775 0.3714 0.3874 0.3736 0.3874 0.3736 0.3489 0.365 0.3578 0.367 0.3677 0.3692 0.3775 0.3714 0.3804 0.3641 0.3441 0.3575 0.3521 0.359 0.3616 0.3608 0.3711 0.3625 0.39 0.3661 0.3521 0.359 0.3616 0.3608 0.3711 0.3625 0.3804 0.3641 cie y cie x cie y cie x cie y cie x cie y cie x cie y cie x d9 d7 d5 d3 d1 4200~4500k 0.39 0.3661 0.3521 0.359 0.3616 0.3608 0.3711 0.3625 0.3804 0.3641 0.3804 0.3641 0.3441 0.3575 0.3521 0.359 0.3616 0.3608 0.3711 0.3625 0.3736 0.3548 0.3385 0.3498 0.3465 0.3511 0.3555 0.3523 0.3646 0.3536 0.3826 0.3562 0.3465 0.3511 0.3555 0.3523 0.3646 0.3536 0.3736 0.3548 cie y cie x cie y cie x cie y cie x cie y cie x cie y cie x d8 d6 d4 d2 d0 4500~4700k 0.3687 0.3463 0.3487 0.3514 0.3578 0.3526 0.3669 0.3539 0.376 0.3552 0.376 0.3552 0.34 0.35 0.3487 0.3514 0.3578 0.3526 0.3669 0.3539 0.3891 0.3572 0.3345 0.3433 0.3428 0.344 0.3514 0.3448 0.3601 0.3456 0.381 0.347 0.3428 0.344 0.3514 0.3448 0.3601 0.3456 0.3687 0.3463 cie y cie x cie y cie x cie y cie x cie y cie x cie y cie x c9 c7 c5 c3 c1 4700~5000k 0.3616 0.3376 0.3428 0.344 0.3514 0.3448 0.3601 0.3456 0.3687 0.3463 0.3687 0.3463 0.3345 0.3433 0.3428 0.344 0.3514 0.3448 0.3601 0.3456 0.381 0.347 0.3288 0.3364 0.3369 0.3366 0.3451 0.3369 0.3534 0.3373 0.374 0.3381 0.3369 0.3366 0.3451 0.3369 0.3534 0.3373 0.3616 0.3376 cie y cie x cie y cie x cie y cie x cie y cie x cie y cie x c8 c6 c4 c2 c0 5000~5300k
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc- qp- 7- 07- 24 rev. 09 rev. 09 september 2011 september 2011 www.seoulsemicon.com www.seoulsemicon.com 6. color & binning color rank * measurement uncertainty of the color coordinates : 0.01 0.4288 0.4354 0.3814 0.4147 0.3931 0.4198 0.4048 0.4248 0.4165 0.4299 0.4165 0.4299 0.3715 0.4104 0.3814 0.4147 0.3931 0.4198 0.4048 0.4248 0.4089 0.4146 0.366 0.3983 0.3751 0.4017 0.3865 0.4062 0.3978 0.4104 0.4217 0.4197 0.3751 0.4017 0.3865 0.4062 0.3978 0.4104 0.4089 0.4146 cie y cie x cie y cie x cie y cie x cie y cie x cie y cie x f9 f7 f5 f3 f1 3200~3500k 0.4217 0.4197 0.3751 0.4017 0.3865 0.4062 0.3978 0.4104 0.4089 0.4146 0.4089 0.4146 0.366 0.3983 0.3751 0.4017 0.3865 0.4062 0.3978 0.4104 0.4015 0.3996 0.36 0.386 0.369 0.3889 0.3798 0.3925 0.3907 0.396 0.414 0.4037 0.369 0.3889 0.3798 0.3925 0.3907 0.396 0.4015 0.3996 cie y cie x cie y cie x cie y cie x cie y cie x cie y cie x f8 f6 f4 f2 f0 3500~3700k 0.416 0.4044 0.3716 0.3898 0.3825 0.3934 0.3935 0.397 0.4044 0.4006 0.4044 0.4006 0.361 0.3863 0.3716 0.3898 0.3825 0.3934 0.3935 0.397 0.3958 0.3869 0.355 0.3758 0.3646 0.3783 0.3751 0.3813 0.3855 0.3842 0.4067 0.3902 0.3646 0.3783 0.3751 0.3813 0.3855 0.3842 0.3958 0.3869 cie y cie x cie y cie x cie y cie x cie y cie x cie y cie x e9 e7 e5 e3 e1 3700~4000k 0.4067 0.3902 0.3646 0.3783 0.3751 0.3813 0.3855 0.3842 0.3958 0.3869 0.3958 0.3869 0.355 0.3758 0.3646 0.3783 0.3751 0.3813 0.3855 0.3842 0.3874 0.3736 0.3489 0.365 0.3578 0.367 0.3677 0.3692 0.3775 0.3714 0.3974 0.376 0.3578 0.367 0.3677 0.3692 0.3775 0.3714 0.3874 0.3736 cie y cie x cie y cie x cie y cie x cie y cie x cie y cie x e8 e6 e4 e2 e0 4000~4200k
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc- qp- 7- 07- 24 rev. 09 rev. 09 september 2011 september 2011 www.seoulsemicon.com www.seoulsemicon.com 6. color & binning color rank * measurement uncertainty of the color coordinates : 0.01 0.4435 0.4875 0.3944 0.4593 0.4069 0.4666 0.4194 0.474 0.4319 0.481 0.4319 0.481 0.383 0.4527 0.3944 0.4593 0.4069 0.4666 0.4194 0.474 0.4289 0.4687 0.3805 0.4422 0.3919 0.4483 0.4042 0.4551 0.4166 0.462 0.441 0.4747 0.3919 0.4483 0.4042 0.4551 0.4166 0.462 0.4289 0.4687 cie y cie x cie y cie x cie y cie x cie y cie x cie y cie x h9 h7 h5 h3 h1 2600~2700k 0.441 0.4747 0.3919 0.4483 0.4042 0.4551 0.4166 0.462 0.4289 0.4687 0.4289 0.4687 0.3805 0.4422 0.3919 0.4483 0.4042 0.4551 0.4166 0.462 0.426 0.4562 0.3778 0.4312 0.3893 0.4373 0.4015 0.4436 0.4138 0.4499 0.4378 0.4619 0.3893 0.4373 0.4015 0.4436 0.4138 0.4499 0.426 0.4562 cie y cie x cie y cie x cie y cie x cie y cie x cie y cie x h8 h6 h4 h2 h0 2700~2900k 0.4378 0.4619 0.3893 0.4373 0.4015 0.4436 0.4138 0.4499 0.426 0.4562 0.426 0.4562 0.3778 0.4312 0.3893 0.4373 0.4015 0.4436 0.4138 0.4499 0.4212 0.443 0.3744 0.4207 0.3853 0.4259 0.3973 0.4317 0.4093 0.4374 0.4333 0.4487 0.3853 0.4259 0.3973 0.4317 0.4093 0.4374 0.4212 0.443 cie y cie x cie y cie x cie y cie x cie y cie x cie y cie x g9 g7 g5 g3 g1 2900~3000k 0.4333 0.4487 0.3853 0.4259 0.3973 0.4317 0.4093 0.4374 0.4212 0.443 0.4212 0.443 0.3744 0.4207 0.3853 0.4259 0.3973 0.4317 0.4093 0.4374 0.4165 0.4299 0.371 0.4102 0.3814 0.4147 0.3931 0.4198 0.4048 0.4248 0.4288 0.4354 0.3814 0.4147 0.3931 0.4198 0.4048 0.4248 0.4165 0.4299 cie y cie x cie y cie x cie y cie x cie y cie x cie y cie x g8 g6 g4 g2 g0 3000~3200k
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc- qp- 7- 07- 24 rev. 09 rev. 09 september 2011 september 2011 www.seoulsemicon.com www.seoulsemicon.com *option h high cri z1 g5 s5 forward voltage cie luminous intensity bin code a~h color rank @ i f = 100ma 3.4 3.3 a1 3.0 2.9 y3 3.1 3.0 z1 3.2 3.1 z2 3.3 3.2 z3 max. min. bin code forward voltage (v) @ i f = 100ma 32.5 11000 10500 t5 31 10500 10000 t0 30 10000 9500 s5 27.6 9000 8500 r5 28.9 26 typ [note] flux (lm) 8500 8000 r0 9500 9000 s0 max. min. bin code luminous intensity (mcd) @ i f = 100ma [note] all measurements were made under the standar dized environment of ssc. in order to ensure availability, single color rank will not be orderable. 7. bin code description available ranks not yet available ranks iv rank t5 t0 s5 s0 r5 r0 f 3200~3700 k t5 t0 s5 s0 r5 r0 d 4200~4700 k h g e c b a cie t5 t0 s5 s0 r5 r0 2600~2800 k t5 t0 s5 s0 r5 r0 5300~6000 k t5 t0 s5 s0 r5 r0 3700~4200 k t5 t0 s5 s0 r5 r0 2900~3200 k t5 t5 s5 s5 r5 r5 s0 s0 t0 r0 4700~5300 k t0 r0 6000~7000 k cct [note] ssc sort the led package according to the lu minous intensity iv. (the lumen table is only for reference.)
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc- qp- 7- 07- 24 rev. 09 rev. 09 september 2011 september 2011 www.seoulsemicon.com www.seoulsemicon.com 8. outline dimension a c2 c1 slug (anode) slug (anode) slug (anode) slug (anode) n.c n.c n.c n.c package package package package marking marking marking marking ( tolerance: 0.1, unit: mm ) [note] forward current is 50ma per die for parallel inner circuit. package total forward current is 100ma 0.65 2.80 0.65 1.10 1.10 0.40 1.80 4.10 0.95 [recommended solder pattern] 9. material structure si thermo plastic silicone metal blue led metal description description description description - zener diode +phosphor encapsulation gold wire wire gan on sapphire chip source heat- resistant polymer body copper alloy (silver plated) lead frame materials materials materials materials name name name name parts no. parts no. parts no. parts no.
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc- qp- 7- 07- 24 rev. 09 rev. 09 september 2011 september 2011 www.seoulsemicon.com www.seoulsemicon.com 180 2 13 22 60 15.4 1.0 13 0.3 10. reel structure ( tolerance: 0.2, unit: mm ) (1) quantity : 3,500pcs/reel (2) cumulative tolerance : cumulative tolerance/10 pitches to be 0.2mm (3) adhesion strength of cover tape : adhesion stre ngth to be 0.1-0.7n when the cover tape is turned o ff from the carrier tape at the angle of 10o to the carrier tape (4) package : p/n, manufacturing data code no. and quantity to be indicated on a damp proof package
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc- qp- 7- 07- 24 rev. 09 rev. 09 september 2011 september 2011 www.seoulsemicon.com www.seoulsemicon.com 11. soldering 10 sec. max. soldering time condition 240 max. peak-temperature 120 sec. max. pre-heat time 120~150 pre-heat lead solder 10 sec. max. soldering time condition 260 max. peak-temperature 120 sec. max. pre-heat time 150~200 pre-heat lead free solder lead solder 2.5~5 c / sec. o o o pre-heating 120~150 c 120sec. max. 60sec. max. above 200 c o 240 c max. 10 sec. max. 2.5~5 c / sec. (1) lead solder (2) lead-free solder (3) hand soldering conditions do not exceed 4 seconds at maximum 315oc under sold ering iron. lead-free solder 1~5 c / sec. o o o o 1~5 c / sec. pre-heating 150~200 c 120sec. max. 60sec. max. above 220 c o 260 c max. 10 sec. max. (4) the encapsulated material of the leds is silicon e. precautions should be taken to avoid the strong pre ssure on the encapsulated part. so when using the chip mounter, the picking up nozz le that does not affect the silicone resign should be used. (5) it is recommended that the customer use the nit rogen reflow method. (6) repairing should not be done after the leds have been soldered. (7) reflow soldering should not be done more than t wo times. in the case of more than 24 hours passed soldering after first, leds will be damaged. (8) we recommend using solder paste composed of agcus n, because pastes that contain bi or b might cause color change of ag during surface mount technology.
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc- qp- 7- 07- 24 rev. 09 rev. 09 september 2011 september 2011 www.seoulsemicon.com www.seoulsemicon.com c a b 1 side 7inch 245 220 142 size (mm) outer box structure material : paper(sw3b(b)) type a b c 1 humidity indicator aluminum vinyl bag reel desi pak part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. rohs 12. packing
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc- qp- 7- 07- 24 rev. 09 rev. 09 september 2011 september 2011 www.seoulsemicon.com www.seoulsemicon.com 13. precaution for use (1) storage in order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desicator) with a desiccant. otherwise, to store th em in the following environment is recommended. temperature : 5oc ~30oc humidity : maximum 70%rh (2) attention after open. led is correspond to smt, when led be soldered dip, interfacial separation may affect the light transmission efficiency, causing the ligh t intensity to drop. attention in followed; keeping of a fraction temperature : 5 ~ 40oc humidity : less than 30% (3) in the case of more than 1 week passed after op ening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60 5oc. (4) silver plating might be tarnished in the enviro nment that contains corrosive gases and materials. also any product that has tarnished lead might be decreased the solder-ability and optical-electrical properties co mpare to normal ones. please do not expose the product in the corrosive e nvironment during the storage. (5) any mechanical force or any excess vibration sh all not be accepted to apply during cooling process to normal temperature after solderi ng. (6) quick cooling shall be avoided. (7) components shall not be mounted on warped direc tion of pcb. (8) anti radioactive ray design is not considered f or the products. (9) this device should not be used in any type of f luid such as water, oil, organic solvent etc. when washing is required, ipa should b e used. (10) when the leds are illuminating, operating curre nt should be decided after considering the ambient maximum temperature. (11) the leds must be soldered within seven days aft er opening the moisture-proof packing. (12) repack unused products with anti-moisture pack ing, fold to close any opening and then store in a dry place. (13) the appearance and specifications of the produ ct may be modified for improvement without notice.
z-power led x10490 z-power led x10490 technical data sheet document no. : ssc- qp- 7- 07- 24 rev. 09 rev. 09 september 2011 september 2011 www.seoulsemicon.com www.seoulsemicon.com 14. handling of silicone resin leds 1) during processing, mechanical stress on the surf ace should be minimized as much as possible. sharp objects of all types should not be used to pi erce the sealing compound. 2) in general, leds should only be handled from the side. by the way, this also applies to leds without a silicone sealant, since the surface can a lso become scratched. 3) when populating boards in smt production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical press ure on the surface of the resin must be prevented. this is assured by choosing a pick and place nozzle which is larger than the leds reflector area. 4) silicone differs from materials conventionally u sed for the manufacturing of leds. these conditions must be considered during the handling of such devi ces. compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. as mentioned previously, the increased sensitivity to dust requires special care during processing. in cases where a minimal level of dirt and dust par ticles cannot be guaranteed, a suitable cleaning sol ution must be applied to the surface after the soldering of components. 5) ssc suggests using isopropyl alcohol for cleanin g. in case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. ultrasonic cleaning is not recommended. ultrasonic cleaning may cause damage to the led. 6) please do not mold this product into another res in (epoxy, urethane, etc) and do not handle this product with acid or sulfur mate rial in sealed space.

▲Up To Search▲

Price & Availability of STW8Q2PAE0E5

	To Download STW8Q2PAE0E5 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .